A saddle profile refers to a specific temperature / time progression in the reflow soldering process. The profile shows 4 distinct zones. The first phase is the preheat phase, during which the board and the components are brought slowly to a temperature of appr. 150° C. The second phase is the activation- or holding phase. Here, the temperature is maintained between 150° C and 190°C. The flux is being activated to assure good wetting and any temperature differences across the board are being homogenized. After this, the board enters the soldering zone, in which the temperature is raised quickly above the melting point of the solder paste and up to the maximum temperature. The last phase is the cool down phase, where the board is being cooled again in a controlled manner.