One of the highlights at our booth was the debut of the HR 600P BGA Rework System for the professional replacement of false processors/BGAs on a circuit board. This state-of-the-art system offers higher precision and features an automatic scavenger for removing solder residue, setting a new standard in rework technology.
我们展台的亮点之一是首次亮相的 HR600P BGA 返修系统，该系统用于专业更换电路板上的失效器件（比如BGA）。这套先进的系统具有更高的精度和自动清除焊接残留物的功能，为返修技术设定了新标准。
We also introduced the VERSAFLOW ONE selective soldering machine to the Chinese market for the first time. Engineered in Germany and assembled in China, this machine combines the best of both worlds. Its local assembly ensures lower landing costs and faster delivery times, making it an ideal solution for manufacturers seeking efficiency at best price performance ratio.
Another centerpiece was the HOTFLOW THREE, our new technology benchmark in reflow soldering. This machine exemplifies our commitment to innovation and excellence, offering unparalleled performance for modern manufacturing needs and extended time between maintenance up to 12 weeks and more, depending on the load. The bustling atmosphere at Nepcon Asia was a clear indication that China´s electronics manufacturing sector remains the largest and most dynamic in the world. We were delighted to engage with a diverse group of visitors, not only from across China but also international guests from Europe and particularly Southeast Asia. We extend our heartfelt thanks to everyone who visited our booth.
The bustling atmosphere at Nepcon Asia was a clear indication that China´s electronics manufacturing sector remains the largest and most dynamic in the world. We were delighted to engage with a diverse group of visitors, not only from across China but also international guests from Europe and particularly Southeast Asia. We extend our heartfelt thanks to everyone who visited our booth.
