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ERSA Optical Inspection

Optical inspection system ERSASCOPE M + ERSASCOPE M plus

Inspection systems for fast inspection of hidden solder joints

Article no.: 0VSSC080 / 0VSSC080P

Versatile. Designed for optical inspection and digital image acquisition – including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.

Technical Highlights

  • Inspection system with two quick-change objectives:
    • 90° BGA optics (approx. 280 µm gap) 
    • 0° macro zoom inspection optics
  •   Fast inspection of hidden solder joints

  • Integrated, dimmable LED illumination

  • N-MOS color camera 5 megapixel, with USB connection

  • Additional LED fiber light or LED light source with gooseneck and light fan

  • Ideal for stationary inspection

  • Ersa ImageDoc v3 inspection software (basic version) included

Specifications Ersa
inspection systems

  • Dimensions (WxDxH) in mm: 500 x 520 x 400
  • Weight in kg: 5
  • Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics
  • Version antistatic (y/n): yes
  • Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB)
  • Dimensions (LxWxH) in mm: 114 x 36 x 51 (without supply cable)
  • Weight in g: 210
  • Principle: integrated optical system with built-in camera and LED light source
  • Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics)
  • Light control: potentiometer (0-100%)
  • Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment
  • Focus adjustment: integrated focus ring on optics
  • Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics
  • Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90°
  • Application: Inspection of hidden solder joints with gap dimensions from 50 to 1,500 µm (BGA, PLCC, QFP etc.)
  • Total length in mm: 83
  • Weight in g: 60
  • Magnification: up to 15x – 180x (on 14″ monitor)
  • Footprint: 8.2 x 0.8 mm
  • Focus range: 0.5-30 mmm
  • Design: integrated zoom optics, built-in dimmable LED illumination, distance pin with three distance levels
  • Application: fast, flexible supervisory inspection at high magnification
  • Total length in mm: 43 (with telecopic support max. 85)
  • Weight in g: 35
  • Magnification: 8x – 80x (14″ monitor)
  • Focus range: 5-200 mm
  • Design: 1/3″ N-MOS solid-state color image sensor, permanently integrated in MOBILE SCOPE base unit
  • Mark of conformity: CE
  • Version antistatic (y/n): yes
  • Design: X/Y table with fine adjustment, rotatable, ball bearing mounted, aluminum, with four additional support feet
  • Dimensions (WxH) in mm: diameter 320 x 80
  • Travel range: 80 mm in X and Y direction, 360° rotatable with 90° detent option
  • Weight in kg: 5
  • Antistatic version (y/n): yes


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Hotline: 400-876-1779