NEPCON Asia opened strongly in Shenzhen, with 38,028 visitors on Day 1, up 36.8% compared with 2025. The high turnout brought many opportunities to meet customers, and we heard a consistent message from electronics manufacturers: boards are becoming more complex. Large, dense AI boards place greater demands on the soldering process, while tiny components on the same board can be sensitive to heat. Getting the temperature profile right across the whole assembly is increasingly important.
The cost of getting it wrong is also rising. As chips become more valuable, soldering defects can mean more than rework or lost production time. They can put high-value components and the finished product at risk. Manufacturers are looking beyond the initial price of a machine to consider process consistency, repeatability, and long-term production value.
The conversations at the exhibition reflected a clear shift. Reliability is not just a machine feature. It helps protect both product value and production performance.
That belief is at the heart of our theme, “Reliability, solidified,” and our new HOTFLOWTHREE 32, a 16-zone machine made at our factory in China, attracted strong interest from visitors. Ersa’s made-in-China selective soldering solutions also drew considerable attention. As board designs evolve, precise thermal control is becoming essential to reliable manufacturing. Thank you to everyone who visited us at NEPCON Asia and shared their challenges and priorities. The conversations continue beyond the exhibition, and we look forward to helping manufacturers seize the opportunities of the AI era with reliable production quality.
