From 25 to 27 March 2026, productronica China and SEMICON China run in parallel at the Shanghai New International Expo Centre (SNIEC)—two leading trade fairs, one venue, one intensive week. It’s an ideal opportunityto meet customers and partners across electronics manufacturing and semicon. And it’s not just global trends: production scale and performance requirements continue to accelerate in Asia—and they’re among the key topics discussed on the show floors.
AI is still the key demand driver. Big tech companies continue to invest in capex to expand computing capacity, so cloud data centers and AI factories keep growing—and that is raising the bar for hardware manufacturing. Boards are getting more complex, especially around large processing units like GPUs and CPUs and high-density designs, where stable temperature control and low-oxygen process conditions really matter.
That’s exactly where Kurtz Ersa supports customers: HOTFLOW THREE delivers high heat transfer with a very low ΔT, even on demanding GPU-heavy assemblies—helping enable stable, high-volume processes. And if rework is needed on high-tech electronics, our large BGA rework solutions (including solder scavenger) are there to support.
The other big news: Kurtz Ersa goes SEMICON. With i-line high vacuum soldering, we’re addressing key semiconductor requirements for power devices like IGBT and SiC, MOSFET, plus advanced packaging—another strong step from electronics into semicon, and a clear signal we’re ready for the next stage of industry evolution.
