At NEPCON Asia 2025 in Shenzhen, China, one thing became clear: behind the fading buzz, electronics manufacturers are facing real challenges from AI and cloud computing. Conversations at the Kurz Ersa booth centered on the rapid growth of processor and GPU packages, which are often 100 × 100 mm or larger, raising the bar for thermal performance and process control.
The HOTFLOW THREE reflow platform is highlighted as a solution for soldering complex, large-size BGAs with strong thermal performance and low delta T across both the PCB and large packages. Kurtz Ersa produces its reflow ovens in Zhuhai, near Shenzhen, enabling fast delivery, a quick response to market needs, and a competitive price-performance ratio.
For high-value AI and cloud computing printed circuit boards (which often cost several thousand dollars) and require repair, advanced rework solutions like the newly released HR600P are presented to help protect investments and reduce waste. Another key message is that Kurtz Ersa’s selective soldering machines are now produced in China as well, extending the “local for local” approach to the Versaflow machine platform.
The core message on the exhibition booth echoing “Made in China 2025.” Production in Germany, China, and Mexico follows one global standard for quality and processes. In China, manufacturing in Zhuhai enables faster delivery, better availability, and strong added value — bringing German engineered technology closer to regional customers for high-tech electronic production enabling AI.
