Chips and BGAs are too valuable to leave to chance. Protect every board with more than a machine: proven soldering technology, process expertise, and support from a trusted name in the industry.
Together, we can help prepare your production for the AI era and capture the opportunities ahead.
At NEPCON Asia in Shenzhen, discover our proven solutions for reflow, selective soldering, and semiconductor applications. See our new Hotflow THREE 32, a 16-heat-zone machine made in China, designed to help minimize temperature differences between large BGAs and small components, while achieving a smoother temperature profile.
Meet our team to discuss what’s next for your production:
Kurtz Ersa at NEPCON Asia 2026
Date: 27 – 29 Oct 2026
Venue: Shenzhen World Exhibition & Convention Center (Baoan)
Booth: Hall 11, F75
