Kurtz Ersa Showcasing Vacuum Soldering @ 10⁻⁶ at CIOE

The 27th China International Optoelectronic Exposition (CIOE 2026) will be held September 9–11 at the Shenzhen World Exhibition & Convention Center (Bao’an). Following the integration of ATV Technologie GmbH into the Kurtz Ersa Group on September 1, 2025, the business operates as Kurtz Ersa Semicon GmbH. At booth 2B065, Kurtz Ersa Semicon will present high‑quality vacuum soldering systems, demonstrating capabilities in microelectronics and semiconductor technology.

Kurtz Ersa Semicon focuses on the development and distribution of high‑quality vacuum soldering systems. The equipment uses a formic acid process to remove metal oxide layers. Combined with high‑vacuum capability to 10⁻⁶ mbar on applicable systems, this significantly reduces voids. In a sealed process chamber, repeated evacuation and high‑purity nitrogen backfill reduce oxygen to below 3 ppm, reliably suppressing oxidation. With precise temperature control and excellent temperature uniformity, the systems deliver stable, repeatable soldering results that meet the stringent requirements of semiconductor and microelectronics manufacturing and support device reliability and lifetime.

Show highlights: formic acid vacuum soldering systems

  • SRO i‑LINE mass production system: innovative infrared heating; up to three process chambers in a compact footprint; during maintenance, two chambers can continue operating while one is serviced. Designed for high‑volume power module production in electric mobility, renewable energy, and defense applications.
  • SRO‑716 vacuum soldering system: ideal for R&D and pilot production; independently adjustable heating zones; process temperatures up to 450 °C (optional 750 °C); supports solder paste and preforms. Optional high‑vacuum configuration available.

The portfolio spans front‑end and back‑end needs and includes customized solutions for universities, research institutes, laboratories, and manufacturing companies. We invite industry professionals to visit Hall 2, booth 2B065, to discuss formic acid and high‑vacuum soldering processes and explore tailored solutions for production lines.