CIOE Takeaway: Setting the Right “Weather” for Solder

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At China International Optoelectronic Exposition (CIOE), one of Asia’s largest optoelectronics and semiconductor exhibition, many buyers shared the same concern: AI chips and advanced sensors are getting more expensive and often hard to secure. When materials are costly and scarce, every scrap incident wastes money and time. As you trace from joint outcomes back through the process, the trail often leads to the “weather” in the chamber: the formic acid, oxygen level, and vacuum profile that quietly set the stage.

Kurtz Ersa Showcasing Vacuum Soldering @ 10⁻⁶ at CIOE

The 27th China International Optoelectronic Exposition (CIOE 2026) will be held September 9–11 at the Shenzhen World Exhibition & Convention Center (Bao’an). Following the integration of ATV Technologie GmbH into the Kurtz Ersa Group on September 1, 2025, the business operates as Kurtz Ersa Semicon GmbH. At booth 2B065, Kurtz Ersa Semicon will present high quality vacuum soldering systems, demonstrating capabilities in microelectronics and semiconductor technology.

Perfect Match – Kurtz Ersa Asia Kicks Off Strategic Alliance with Interflux Singapore

Perfect Match - Kurtz Ersa Asia Kicks Off Strategic Alliance with Interflux Singapore

We are pleased to announce a new strategic alliance between Kurtz Ersa Asia and Interflux Singapore, further expanding Kurtz Ersa’s Through-Hole Technology (THT) portfolio. The combination of interflux innovation fluxing technology with Kurtz Ersa’s leading wave soldering and selective soldering systems, offers customers an even broader range of technologically advanced capabilities and fluxing process options. […]

CHINAPLAS: Returning to the Core of Foam Molding Machines

Kurtz Ersa, with almost 250 years of industry heritage, is presenting at CHINAPLAS 2026. As a major global event for the plastics industry, the exhibition brings together experts and customers from across the rubber and plastics sector. Taking this opportunity, we revisit the fundamentals of the foam molding industry.

From Electronics to Semicon: Kurtz Ersa’s Shanghai Double

From 25 to 27 March 2026, productronica China and SEMICON China run in parallel at the Shanghai New International Expo Centre (SNIEC)—two leading trade fairs, one venue, one intensive week. It’s an ideal opportunityto meet customers and partners across electronics manufacturing and semicon. And it’s not just global trends: production scale and performance requirements continue to […]

Kurtz Ersa expands product range in the semiconductor & microelectronics sector

Following the takeover of the business operations of the former ATV Technologie GmbH by Kurtz Ersa Semicon GmbH on September 1, 2025, Kurtz Ersa is now taking the next step in process technologies for microelectronics and microoptics with the takeover of Häcker Automation GmbH by Kurtz Ersa Smart Production GmbH on December 1, 2025. All employees will be retained.

Kurtz Ersa enters the semiconductor industry

Kurtz Ersa has taken over the business operations of the insolvent equipment manufacturer ATV Technologie GmbH, based in Vaterstetten near Munich, as of September 1, 2025. For Kurtz Ersa, this is the strategic step into the market for production systems for the semiconductor industry that has been announced for some time. All ATV employees will be taken over. With around 50 employees, ATV develops, produces and supplies high-temperature vacuum reflow soldering machines for the chip industry, which are required for the process step of contacting the wafer with external connecting wires. Kurtz Ersa is thus moving upstream in the electronics production value chain.